CVE-2019-14093 (apq8009_firmware, apq8017_firmware, apq8053_firmware, apq8096au_firmware, apq8098_firmware, mdm9206_firmware, mdm9207c_firmware, mdm9607_firmware, mdm9650_firmware, msm8909w_firmware, msm8917_firmware, msm8920_firmware, msm8937_firmware, msm8940_firmware, msm8953_firmware, msm8996_firmware, msm8996au_firmware, qcm2150_firmware, qcs405_firmware, qcs605_firmware, qm215_firmware, sda660_firmware, sda845_firmware, sdm429_firmware, sdm429w_firmware, sdm439_firmware, sdm450_firmware, sdm632_firmware, sdm636_firmware, sdm660_firmware, sdx20_firmware)

Array out of bound access can occur in display module due to lack of bound check on input parcel received in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, QCM2150, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM636, SDM660, SDX20

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